International Journal of Nano Dimension (Int. J. Nano Dimens.) Annealing temperature effect on nanostructure and phase transition of Copper Oxide thin films Volume 2 (2011) Issue 3, March 2012 2024 03 01 Annealing temperature effect on nanostructure and phase transition of Copper Oxide thin films 10.7508/ijnd.2011.03.006 EN K. Khojier Department of Physics, Chalous branch, Islamic Azad University, Chalous, Iran. A. Behju Department of Chemistry, Chalous branch, Islamic Azad University, Chalous, Iran. Journal Article 2024 03 01 This paper addresses the annealing temperature effect on nanostructure and phase transition of copper oxide thin films, deposited by PVD method on glass substrate (at 110 nm thickness) and post annealed at different temperatures (200-400°C) with a flow of 1 cm3s-1 Oxygen. The X-ray diffraction (XRD) was employed for crystallographic and phase analyses, while atomic force microscopy (AFM) was used for morphology investigation. The results showed (CuO2) cuprite phase for samples annealed at 200 and 250°C and (CuO) tenorite phase for samples annealed at 350 and 400°C, while sample annealed at 300°C had a complex phases (CuO2 and CuO). The size of the grains increased, but roughness increased and then decreased by increasing of annealing temperature. Furthermore, calculated activation energy from grain diameter (at arrhenius plot) was 0.54 eV.