<?xml version="1.0" encoding="UTF-8"?><!DOCTYPE ArticleSet PUBLIC "-//NLM//DTD PubMed 2.7//EN" "https://dtd.nlm.nih.gov/ncbi/pubmed/in/PubMed.dtd">
<ArticleSet>
		<Article>
		<Journal>
			<PublisherName>Majlesi Journal of Electrical Engineering</PublisherName>
			<JournalTitle>A 3.1-10.6 GHz HEMT Distributed Amplifier for Ultra-Wideband Application</JournalTitle>
			<Issn></Issn>
			<Volume>Volume 6 (2012)</Volume>
			<Issue>Issue 4, November 2012</Issue>
			<PubDate PubStatus="epublish">
                <Year>2024</Year>
                <Month>02</Month>
                <Day>25</Day>
			</PubDate>
		</Journal>
		<ArticleTitle>A 3.1-10.6 GHz HEMT Distributed Amplifier for Ultra-Wideband Application</ArticleTitle>
		<VernacularTitle></VernacularTitle>
		<FirstPage></FirstPage>
		<LastPage></LastPage>
		<ELocationID EIdType="doi"></ELocationID>
		<Language>EN</Language>
		<AuthorList>
            			<Author>
                				<FirstName>Sepideh</FirstName>
				<LastName>Ebrahimi</LastName>
				<Affiliation>Young Researchers Club, Islamic Azad University, Aligodarz Branch, Aligodarz</Affiliation>
				<Identifier Source="ORCID"></Identifier>
			</Author>
            			<Author>
                				<FirstName>Alishir</FirstName>
				<LastName>Moradikordalivand</LastName>
				<Affiliation>Faculty of Electrical Engineering, University Technology Malaysia, Johor</Affiliation>
				<Identifier Source="ORCID"></Identifier>
			</Author>
            		</AuthorList>
		<PublicationType>Journal Article</PublicationType>
		<History>
			<PubDate PubStatus="received">
				<Year>2024</Year>
				<Month>02</Month>
				<Day>25</Day>
			</PubDate>
		</History>
		<Abstract>In this paper, a Distributed Amplifier (DA) by using HEMT technology for ultra-wideband application is presented. Creation of Distributed integrated circuit has been investigated for approximately seventy years rapidly to developing semiconductor process technologies in the modern IC design. By using of this method, multiple parallel signals are combined and obtain to increase the bandwidth, enhanced power combining amplitude, and novel design capabilities for IC process. The circuit was designed and simulated in ED02AH technology by using ADS2010. The 4-stage design achieves 15.5 dB of power gain (±0.5 dB) from 3.1 to 10.6 GHz. Reflected power of the input and output from loads matched to 50 Ohm are all below –10 dB over the bandwidth of the device, as is power transmitted from the output to the input. The device is stable for a wide range of input and output loads.</Abstract>
		<ObjectList>
            			<Object Type="keyword">
				<Param Name="value">Cloud computing, DDoS attacks, Machine Learning, deep learning techniques, . ,</Param>
			</Object>
					</ObjectList>
	</Article>
	</ArticleSet>
